Product / Module Packaging Engineer

Description

Changing the world is all in a day's work at Apple. If you love innovation, here's your chance to make a career of it. You'll work hard. But the job comes with more than a few perks.

Work as Product / Module Packaging engineer supporting sensor hardware engineering projects.

Key Qualifications:
•Qualifications:
•10+ years experience working with module packaging, with diverse experience in areas such as MEMs, Optical packaging, Camera Module
•Work closely with internal cross functional teams, PD, Test, EE, ME
•Understanding of manufacturing, and transition from development to MP
•Ability to work with international teams and travel

Description:
Core responsibilities:

Work together with Emerald TLVDC and Camera core technology team as a packaging / process engineer supporting the IPM (Integrated Photonics module) and/or the BST (MEMS Beam steering module). Role is focused on non traditional packaging of laser + Optics, and MEMS. Specifics include:

IPM module construction development
Substrate technology evaluation (ceramic vs Silicon) for ability to integrate with optics and laser thermal requirements
Process / Materials definition in areas such as Laser Die attach process,Hermetic module development, MEMs, optical assembly
Qualify the BST module: Develop reliability test plan, understand failure mechanisms and work with cross function team to improve performance
Equipment and MI Vendor selection

Education:
BS in Electrical Engineering, Mechanical Engineering or equivalent

Additional Requirements:
Travel expected at 20~30%
Apple is an Equal Employment Opportunity Employer that is committed to inclusion and diversity. We also take affirmative action to offer employment and advancement opportunities to all applicants, including minorities, women, protected veterans, and individuals with disabilities.